MR-0124TXN 101 24

MR-0124, RS-422, with its own power supply and auto-identification, galvanic isolation

COM 1x RS-422
Picture Variant Variant description
The MR-0124 submodule contains 1x RS-422 interface. The internal connection ensures galvanic separation of the interface from the system and power supply circuits. At the same time, the module contains identification circuits The user has the ability to identify the type of submodule used from the development environment.
Order num. TXN 101 24
Teco code TXN 101 24
Categories Foxtrot 1 - Accessories for basic modules, TC700 - Accessories for central modules
Tags Sales and production discontinued
COM - Serial channels
Max. baud rate 2 MBd
Receiver sensitivity (RS-485) min. ±200 mV
Signal output level (RS-485) typ. 3,7 V
Max. length of connected line (RS-485) 1200 m
Note on cable length The maximum length applies to twisted and shielded cable and communication speed max. 120 kBd.
Number of internal RS-422 ports 1
Power supply
Supply voltage, tolerances The submodule is powered from the power supply the terminal device in which it is installed.
Maximum power input 1,2 W
Galvanic separation of power supply from internal circuits No
Insulation voltage of galvanic separation 1 000 VDC
Size and weight
Weight approx. 50 g
Product dimensions (width x height x depth) 47 × 36 × 15 mm
Operating conditions, product standards
Protection class of electrical object III, according to ČSN EN 61140 ed.3: 2016 (idt IEC 61140:2016)
Operating areas Normal, acc. ČSN 33 2000-1 ed.2: 2009 (mod IEC 60354-1:2005)
Degree of pollution 2, according to ČSN EN 60664-1 ed.2: 2008 (idt IEC 60664-1: 2007)
Overvoltage category installation II, according to EN 60664-1 ed_2: 2008 (idt IEC 60641-1: 2007)
Type of device Submodule
Type of operation (operating frequency) Continuous
Ambient operating temperatures -20 °C to + 55 °C
Storage temperatures –25 °C to +70 °C
Packaginng, transportation, storage
Description The submodule is packed in a paper box according to the internal packing instructions. This documentation is also part of the package. Outer packaging is carried out according to the scope of the order and the method of transport in a transport package provided with labels and other data necessary for transport. Transport from the manufacturer is carried out in the manner agreed upon when ordering. The transport of the product by the customer's own means must be carried out by covered means of transport in the position specified by the label on the packaging. The box must be stored in such a way that it does not move spontaneously and the outer packaging is not damaged. The product must not be exposed to direct weather conditions during transport and storage. The product may only be stored in clean rooms free of conductive dust, aggressive gases and vapors. The most suitable storage temperature is 20 ° C.
Assembly description The installation of the submodule in the terminal device is always described in the documentation of the respective device. The submodule is mounted on the tips of the connector forks in the terminal device so that the 14-socket socket of the submodule is exactly opposite the 14-pin connector plug and the 11-socket socket is mounted on those connector forks that come out for insertion. into the sockets: in the case of a connector with a single-row plug, these are all its tips; See Fig. 3.1.
Exchangeable submodules When connecting and / or replacing submodules, the correctness of the fitting of the submodule cavities against the fork tips of the terminal connector must be carefully checked. The sockets do not have position coding and in case of incorrect installation, the submodule and / or the terminal device may be damaged when the power supply is switched on again !!!
Module operation
Module configuration Submodules have printed solder jumpers arranged on the printed circuit board, which can be used to modify the functions of some signals, or they can be used to connect the impedance termination of the communication line (if the submodule is at its end). Submodules are supplied with jumpers configured for the most commonly used submodule function. The figure illustrates the meaning, location and connection of individual jumpers.

The configuration of some jumpers is realized already in the stage of production of a printed circuit board by a printed conductor between the faces of the jumper. This applies to jumpers labeled 'X' and 'CTS' on MR-0114 and jumpers labeled 'CTS', 'RxD', 'TEn', 'RTS' and 'REn' on MR-0124. For these jumpers, the ribbon cable must first be interrupted before changing their configuration. Then it is possible to connect the surfaces only with a drop of tin applied by soldering. The 'RTS Aut' jumper on the MR-0114 submodule is connected only by a drop of tin. The remaining jumpers are not connected.
Commissioning The submodule is ready for operation after checking the connection of jumpers, correct insertion into the position in the terminal device and switching on the power supply of the system.
Module diagnostics The submodule itself is not equipped with any diagnostics. The status of the communication line (activity of transmitted data, received data and RTS signal) is usually indicated by LED diodes on the terminal device. More detailed information can be found in the documentation of the respective device.
Description The module does not require any maintenance under general installation conditions. The operations in which a part of the module has to be dismantled must always be carried out with the supply voltage disconnected.
Warning Because the submodule contains semiconductor components, it is necessary to follow the principles for working with electrostatic sensitive components when handling it. It is not allowed to directly touch the printed circuit boards without protective measures !!!
Generally Warranty and complaint conditions are governed by the Terms and Conditions of Teco a.s.
Warning All conditions of this documentation must be met before switching on the device. The system must not be put into service unless it has been verified and confirmed that the environment of which the module becomes a part meets the requirements of Directive 89/392 / EEC, if applicable. Documentation subject to change.

HW documentation


MR-0104/114/124 - Basic documentation

424.01 kB, (CS, EN)

User manuals



671.90 kB, (EN)

No data available.